TS4601B

Package information

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Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

Figure 53.

TS4601B footprint recommendation

Figure 54.

Pinout

150

μm min.

500

μm

500

μm

Φ=250μm

Φ=400μm typ.

75µm min.

100

μm max.

Track

Non Solder mask opening

Φ=340μm min.

Pad in Cu 18

μm with Flash NiAu (2-6μm, 0.2μm max.)

150

μm min.

500

μm

500

μm

Φ=250μm

Φ=400μm typ.

75µm min.

100

μm max.

Track

Non Solder mask opening

Φ=340μm min.

Pad in Cu 18

μm with Flash NiAu (2-6μm, 0.2μm max.)

Balls are underneath

Top view

Bottom view

C1

C2

PVCC

VCC

GND

PVSS

CMS

VOUTR

VOUTL

INL+

INR+

INL-

INR-

SCL

SDA

SDZ

432

1

A

B

C

D

C1

C2

PVCC

VCC

GND

PVSS

CMS

VOUTR

VOUTL

INL+

INR+

INL-

INR-

SCL

SDA

SDZ

432

1

A

B

C

D

C1

C2

PVCC

VCC

GND

PVSS

CMS

VOUTR

VOUTL

INL+

INR+

INL-

INR-

SCL

SDA

SDZ

123

4

A

B

C

D

C1

C2

PVCC

VCC

GND

PVSS

CMS

VOUTR

VOUTL

INL+

INR+

INL-

INR-

SCL

SDA

SDZ

123

4

A

B

C

D