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STPCI2HEYC Datasheet(PDF) 73 Page - STMicroelectronics

No. de pieza STPCI2HEYC
Descripción Electrónicos  X86 Core PC Compatible System-on-Chip for Terminals
PDF  111 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STPCI2HEYC Datasheet(HTML) 73 Page - STMicroelectronics

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MECHANICAL DATA
Issue 1.0 - July 24, 2002
73/111
Figure 5-6. Thermal Dissipation With Heatsink
Ambient
Case
Junction
Board
Ambient
Ambient
Case
Junction
Board
Rca
Rjc
Rjb
Rba
36
50
8.5
Rja = 9.5 °C/W
Airflow = 0
Board dimensions:
The PBGA is centred on board
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
There are no other devices
Heat sink is 11.1°C/W
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Board temperature taken at the centre balls
Board



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