ES1A thru ES1D

Vishay General Semiconductor

www.vishay.com

For technical questions within your region, please contact one of the following:

PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com

Document Number: 88586

Revision: 27-Aug-08

652

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Figure 3. Typical Instantaneous Forward Characteristics

Figure 4. Typical Reverse Leakage Characteristics

T

T

T

T

100

10

1

0.1

0.01

Instantaneous Forward Voltage (V)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

T

T

T

T

Percent of Rated Peak Reverse Voltage (%)

020

40

60

80

100

1000

100

10

1

0.1

Figure 5. Typical Junction Capacitance

Figure 6. Typical Thermal Impedance

Reverse Voltage (V)

14

12

10

8

6

4

2

0

0.1

1

10

100

T

f = 1.0 MHz

V

Mounted on 0.2 x 0.2" (5 x 7 mm)

Copper Pad Areas

100

10

1

0.1

1

10

100

t - Pulse Duration (s)

0.030 (0.76)

0.060 (1.52)

0.008 (0.203)

0.194 (4.93)

0.208 (5.28)

0.157 (3.99)

0.177 (4.50)

0.100 (2.54)

0.110 (2.79)

0.078 (1.98)

0.090 (2.29)

0.006 (0.152)

0.012 (0.305)

0.049 (1.25)

0.065 (1.65)

Cathode Band

0 (0)

DO-214AC (SMA)

Mounting Pad Layout

0.074 (1.88)

MAX.

0.208 (5.28)

REF.

0.066 (1.68)

MIN.

0.060 (1.52)

MIN.