WSLS2512, Improved Stability

Improved Stability (0.25 % and 0.5 %),

Low Value (0.01

Ω to 0.1 Ω), Surface Mount

Vishay Dale

Document Number: 30123

For technical questions, contact: ww2bresistors@vishay.com

www.vishay.com

Revision: 06-Oct-08

13

DIMENSIONS

Note

• Embossed Carrier Tape per EIA-481-2

L

T

W

H

l

b

a

MODEL

DIMENSIONS in inches [millimeters]

L

WH

T

WSLS2512

0.250 ± 0.010 0.125 ± 0.010 0.025 ± 0.010 0.030 ± 0.010

[6.35 ± 0.254] [3.18 ± 0.254] [0.635 ± 0.254] [0.762 ± 0.254]

MODEL

SOLDER PAD DIMENSIONS in inches [millimeters]

ab

l

WSLS2512

0.065

0.145

0.160

[1.65]

[3.68]

[4.06]

Derating

120

100

80

60

40

20

0

- 65

Ambient Temperature in °C

70

- 50

- 25

75

0

150

100

170

125

25

50

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST LIMITS

0.25 %

0.5 %

Thermal Shock

- 55 °C to + 150 °C, 1000 cycles, 15 min at each extreme

± (0.5 % + 0.005

Ω) ΔR

Short Time Overload

5 x rated power for 5 s for WSL2512 size or smaller

± (0.5 % + 0.005

Ω) ΔR

Low Temperature Operation

- 65 °C for 45 min

± (0.5 % + 0.005

Ω) ΔR

High Temperature Exposure

1000 h at + 170 °C

± (1.0 % + 0.005

Ω) ΔR

Bias Humidity

+ 85 °C, 85 % RH, 10 % Bias, 1000 h

± (0.5 % + 0.005

Ω) ΔR

Mechanical Shock

100 g’s for 6 ms, 5 pulses

± (0.5 % + 0.005

Ω) ΔR

Vibration

Frequency varied 10 to 2000 Hz in 1 min, 3 directions, 12 h

± (0.5 % + 0.005

Ω) ΔR

Load Life

2000 h at 70 °C, 1.5 h “ON”, 0.5 h “OFF”

± 0.25 %

ΔR

± 0.5 %

ΔR

Resistance to Solder Heat

+ 260 °C Solder, 10 to 12 s dwell, 25 mm/s emergence

± (0.5 % + 0.005

Ω) ΔR

Moisture Resistance

MIL-STD-202, Method 106, 0 % power, 7b not required

± (0.5 % + 0.005

Ω) ΔR

PACKAGING

MODEL

REEL

TAPE WIDTH

DIAMETER

PIECES/REEL

CODE

WSLS2512

12 mm/Embossed Plastic

178 mm/7"

2000

EA