©2008 Littelfuse, Inc.

Revised: October 24, 2008

Surface Mount > 2016L Series

2016L Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/2016L.html for current information.

Environmental Specifications

Soldering Parameters

Condition

Reflow

PeakTemp/ DurationTime

260°C / 10 Sec

Time above liquids (TAL) 220°C

60 Sec ~ 100 Sec

Preheat 120°C~ 180°C

50 Sec ~ 150 Sec

Storage Condition

0°C~35°C, <

=70%RH

oven, N

solvents.

Note: If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped

State

125°C

Passive Aging

+85°C, 1000 hours

-/+5% typical resistance change

Humidity Aging

+85°C, 85%,R.H.,1000 hours

-/+5% typical resistance change

Thermal Shock

MIL–STD–202, Method 107G

+85°C/-40°C 20 times

-30% typical resistance change

Solvent Resistance

MIL–STD–202, Method 215

No change

Vibration

MIL–STD–883C, Method 2007.1,

Condition A

No change

Moisture Sensitivity Level

Level 2, J–STD–020C

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material:

Matte Tin(Sn))

Lead Solderability

Meets EIA Specification RS186-9E, ANSI/

J-STD-002 Category 3.

Preheating

120

180

220

260

0

60 to 100

Soldering

Cooling

120

50 to 150

Time(s)