VND05BSP datasheet(3/9 Pages) STMICROELECTRONICS

3 / 9 page

THERMAL DATA

Rthj-case

Rthj-amb

Thermal Resistance Junction-case

Max

Thermal Resistance Junction-ambient ($)

Max

2.1

oC/W

($) When mounted using minimum recommended pad size on FR-4 board

ELECTRICAL CHARACTERISTICS (8 < VCC < 16 V; -40

≤ Tj ≤ 125 oC unless otherwise specified)

POWER

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VCC

Supply Voltage

In(*)

Nominal Current

Tc = 85

oC VDS(on)

≤ 0.5 VCC = 13 V

1.6

2.6

Ron

On State Resistance

IOUT = In VCC = 13 V

Tj = 25

0.13

0.2

Ω

Supply Current

Off State

Tj = 25

VCC = 13 V

100

µA

VDS(MAX)

Maximum Voltage Drop IOUT = 7.5 A

Tj = 85

oC V

CC = 13 V

1.44

2.3

Output to GND internal

Impedance

Tj = 25

o C

Ω

SWITCHING

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

td(on)(^)

Turn-on Delay Time Of

Output Current

Rout = 5.4

Ω

200

µs

tr(^)

Rise Time Of Output

Current

Rout = 5.4

Ω

180

µs

td(off)(^)

Turn-off Delay Time Of

Output Current

Rout = 5.4

Ω

250

µs

tf(^)

Fall Time Of Output

Current

Rout = 5.4

Ω

180

µs

(di/dt)on

Turn-on Current Slope

Rout = 5.4

Ω

0.003

0.1

µs

(di/dt)off

Turn-off Current Slope

Rout = 5.4

Ω

0.005

0.1

µs

LOGIC INPUT

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VIL

Input Low Level

Voltage

1.5

VIH

Input High Level

Voltage

3.5

(

•)V

VI(hyst.)

Input Hysteresis

Voltage

0.2

0.9

1.5

IIN

Input Current

VIN = 5 V

Tj = 25

o C

100

µA

VICL

Input Clamp Voltage

IIN = 10 mA

IIN = -10 mA

-0.7

VND05BSP

3/9

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