DEVICE INFORMATION

PACKAGE CHARACTERISTICS

DEVICE I/O SCHEMATICS

OUT

8 W

13 W

Output

IN

Input

1MW

500 W

EN

Enable

500 W

1MW

REGULATORY INFORMATION

THERMAL CHARACTERISTICS

ISO7240CF, ISO7240C

,, ISO7240M

ISO7241C, ISO7241M

ISO7242C, ISO7242M

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

L(I01)

Minimum air gap (Clearance)

Shortest terminal-to-terminal distance through air

8.34

mm

Shortest terminal-to-terminal distance across the

L(I02)

Minimum external tracking (Creepage)

8.1

mm

package surface

Minimum Internal Gap (Internal

Distance through the insulation

0.008

mm

Clearance)

Isolation resistance

Ω

barrier tied together creating a two-terminal device

Barrier capacitance Input to output

2

pF

Input capacitance to ground

2

pF

VDE

CSA

UL

Recognized under 1577

Certified according to IEC

Approved under CSA Component

Component Recognition

60747-5-2

Acceptance Notice

File Number: 40016131

File Number: 1698195

File Number: E181974

(1)

Production tested

≥ 3000 Vrms for 1 second in accordance with UL 1577.

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

θ

JA

Junction-to-air

°C/W

High-K Thermal Resistance

96.1

θ

JB

Junction-to-Board Thermal Resistance

61

°C/W

θ

JC

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

Copyright © 2007–2008, Texas Instruments Incorporated

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Product Folder Link(s): ISO7240CF, ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M