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STM32F103xC Datasheet(PDF) 109 Page - STMicroelectronics

No. de pieza STM32F103xC
Descripción Electrónicos  High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  123 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103xC Datasheet(HTML) 109 Page - STMicroelectronics

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STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Doc ID 14611 Rev 7
109/123
Figure 61.
WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package outline
1.
Drawing is not to scale.
2.
Primary datum Z and seating plane are defined by the spherical crowns of the ball.
Table 66.
WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
Symbol
millimeters
inches(1)
1.
Values in inches are converted from mm and rounded to 4 decimal digits.
Min
Typ
Max
Min
Typ
Max
A
0.535
0.585
0.635
0.0211
0.0230
0.0250
A1
0.205
0.230
0.255
0.0081
0.0091
0.0100
A2
0.330
0.355
0.380
0.0130
0.0140
0.0150
b(2)
2.
Dimension is measured at the maximum ball diameter parallel to primary datum Z.
0.290
0.320
0.350
0.0114
0.0126
0.0138
e
0.500
0.0197
e1
3.500
0.1378
F
0.447
0.0176
G
0.483
0.0190
D
4.446
4.466
4.486
0.1750
0.1758
0.1766
E
4.375
4.395
4.415
0.1722
0.1730
0.1738
H
0.250
0.0098
L
0.200
0.0079
eee
0.05
0.0020
aaa
0.10
0.0039
Number of balls
64
A
B
C
D
E
F
G
H
1
2
3
4
5
6
7
8
Detail A
Side view
Ball side
Wafer back side
Marking area
A1 ball corner
A
A2
A1 ball corner
Notch
Ball
A1
b
Seating plane (see note 2)
Detail A rotated 90 ˚
CR_ME
e
e
e1
e1
F
G
D
E
aaa
eee
H
L
L



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