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STM32F103xC Datasheet(PDF) 11 Page - STMicroelectronics

No. de pieza STM32F103xC
Descripción Electrónicos  High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  123 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103xC Datasheet(HTML) 11 Page - STMicroelectronics

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STM32F103xC, STM32F103xD, STM32F103xE
Description
Doc ID 14611 Rev 7
11/123
2.1
Device overview
Table 2.
STM32F103xC, STM32F103xD and STM32F103xE features and peripheral
counts
Peripherals
STM32F103Rx
STM32F103Vx
STM32F103Zx
Flash memory in Kbytes
256
384
512
256
384
512
256
384
512
SRAM in Kbytes
48
64(1)
1.
64 KB RAM for 256 KB Flash are available on devices delivered in CSP packages only.
48
64
48
64
FSMC
No
Yes(2)
2.
For the LQFP100 and BGA100 packages, only FSMC Bank1 and Bank2 are available. Bank1 can only
support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or
8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is
not available in this package.
Yes
Timers
General-purpose
4
Advanced-control
2
Basic
2
Comm
SPI(I2S)(3)
3.
The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the
I2S audio mode.
3(2)
I2C2
USART
5
USB
1
CAN
1
SDIO
1
GPIOs
51
80
112
12-bit ADC
Number of channels
3
16
3
16
3
21
12-bit DAC
Number of channels
2
2
CPU frequency
72 MHz
Operating voltage
2.0 to 3.6 V
Operating temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 10)
Junction temperature: –40 to + 125 °C (see Table 10)
Package
LQFP64
WLCSP64
LQFP100, BGA100
LQFP144, BGA144



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