P r o d u c t I n n o v a t i o n F r o m

SA50CE

2

SA50CEU

ABSOLUTEMAXIMUMRATINGS

SUPPLY VOLTAGE, +V

S

OUTPUT CURRENT, peak

7A

LOGIC SUPPLY VOLTAGE, Vcc

16V

POWER DISSIPATION, internal

TEMPERATURE, pin solder - 10s

300°C

175°C

TEMPERATURE, storage

–65 to +150°C

OPERATING TEMPERATURE RANGE, case

–65 to +125°C

INPUT VOLTAGE

+1V to Vcc – 1.5 Vdc

SPECIFICATIONS

PARAMETER

MIN

TYP

MAX

UNITS

INPUT

ANALOG INPUT VOLTAGES

Vcc = 9.5V to 15V

MOTOR A, B = 50% Duty Cycle

V

V

2V

V

V

V

OUTPUT

Vds (ON) VOLTAGE, each MOSFET

Ids = 5A

1.0

1.3

Vdc

TOTAL Ron, both MOSFETs

0.4

Ω

EFFICIENCY, 5A OUTPUT

+V

95

%

SWITCHING FREQUENCY

40

45

50

kHz

CURRENT, continuous

5

A

CURRENT, peak

t = 100 m-sec

7

A

+V

RISE TIME

36

54

ns

FALL TIME

170

250

ns

DEAD TIME

100

ns

POWER SUPPLY

+V

5

+V

80

V

Vcc VOLTAGE

9.5

12

15

V

Vcc CURRENT

Vcc = 12Vdc

20

30

mA

RESISTANCE, junction to case

Full temp range, for each transistor

2.0

°C/W

RESISTANCE, junction to air

Full temperature range

30

°C/W

TEMPERATURE RANGE, case

–40

+85

°C

The SA50CE is constructed from MOSFET transistors. ESD handling procedures must be observed.

The internal substrate contains beryllia (BeO). Do not break the seal. If accidentally broken, do not crush, machine, or

subject to temperatures in excess of 850°C to avoid generating toxic fumes.

NOTES: 1. Each of the two active output transistors can dissipate 36W. This is an output FET rating only; normal operation at worst case

conditions and maximum duty cycle only causes 19 watts internal heat generation in each active output FET. Use 40 watts

maximum to size heatsink.

2. Unless otherwise noted: T

3. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to

achieve high MTTF. For guidance, refer to the heatsink data sheet.

4. Guaranteed but not tested.

5. Derate linearly to 70V at – 40°C from T

The SA50CE contains an internal logic chip that turns on

and turns off output MOSFET drivers at a certain sequence.

Noises or oscillation caused by external wiring inductance,

lack of proper power supply bypass capacitors, ground, sup-

ply and local internal loops, may be fed back to this logic chip

and cause it to turn on one or more MOSFET drivers at the

wrong time, thus destroying the SA50CE. A well laid out PC

board with low impedance copper ground plane and excellent

bypassing is necessary for the SA50CE to function properly.

A low ESR high frequency bypass capacitor, such as a 0.1 µf

100V X7R ceramic, or better, should be mounted as close to

the Vs and ground pins as possible to avoid radiation of high

frequency transients on the power supply wiring. The Apex

Precision Power EK-SA50CE evaluation board is recommended

for fast and easy breadboarding of circuits using the SA50CE.