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VIV0104THJ Datasheet(PDF) 13 Page - Vicor Corporation |
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VIV0104THJ Datasheet(HTML) 13 Page - Vicor Corporation |
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13 / 16 page ![]() VIV0104THJ Rev. 1.3 9/2009 Page 13 of 16 V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 vicorpower.com VIN VOUT + – DC ZIN_EQ1 ZIN_EQ2 ZOUT_EQ1 ZOUT_EQ2 Load VTM1 RO_1 VTM2 RO_2 VTMn RO_n ZOUT_EQn ZIN_EQn Figure 17 – VTM Array 6.0 FUSE SELECTION V•I Chips are not internally fused in order to provide flexibility in configuring power systems. Input line fusing of V•I Chips is recommended at system level, to provide thermal protection in case of catastrophic failure. The fuse shall be selected by closely matching system requirements with the following characteristics: • Current rating (usually greater than maximum VTM current) • Maximum voltage rating (usually greater than the maximum possible input voltage) • Ambient temperature • Nominal melting I2t 7.0 CURRENT SHARING The SAC topology bases its performance on efficient transfer of energy through a transformer, without the need of closed loop control. For this reason, the transfer characteristic can be approximated by an ideal transformer with some resistive drop and positive temperature coefficient. This type of characteristic is close to the impedance characteristic of a DC power distribution system, both in behavior (AC dynamic) and absolute value (DC dynamic). When connected in an array (with same K factor), the VTM module will inherently share the load current with parallel units, according to the equivalent impedance divider that the system implements from the power source to the point of load. It is important to notice that, when successfully started, VTMs are capable of bi-directional operations (reverse power transfer is enabled if the VTM input falls within its operating range and the VTM is otherwise enabled). In parallel arrays, because of the resistive behavior, circulating currents are never experienced, because of energy conservation law. General recommendations to achieve matched array impedances are (see also AN016 for further details): • to dedicate common copper planes within the PCB to deliver and return the current to the modules • to provide the PCB layout as symmetric as possible • to apply same input/output filters (if present) to each unit |
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