LP3984 datasheet(7/8 Pages) POWER

No. de pieza	LP3984

Descripción Electrónicos	300mA,Ultra-low noise, Small Package Ultra-Fast CMOS LDO Regulator

PDF	8 Pages

Scroll/Zoom	100%

Fabricante Electrónico	POWER [Lowpower Semiconductor inc]

Página de inicio	http://www.lowpowersemi.com

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7 / 8 page

Preliminary Datasheet

LP3984

LP3984 – 01 Ver. 1.1 Datasheet

Jul.-2008

Page 7 of 8

The power dissipation definition in device is :

PD = (VIN−VOUT) x IOUT + VIN x IQ

The maximum power dissipation depends on the thermal

resistance of IC package, PCB layout, the rate of

surroundings airflow and temperature difference between

junction to ambient.

The maximum power dissipation can be calculated by

following formula :

PD(MAX) = ( TJ(MAX) − TA ) /θJA

Where TJ(MAX) is the maximum operation junction

temperature 125°C, TA is the ambient temperature and

the θJA is the junction to ambient thermal resistance. For

recommended operating conditions specification of

LP3984, where TJ(MAX) is the maximum junction

temperature of the die (125°C) and TA is the maximum

ambient temperature. The junction to ambient thermal

resistance (θJA is layout dependent) for SOT23-5

package is 250°C/W.

PD(MAX) = (125°C−25°C) / 250 = 400mW (SOT23-5)

PD(MAX) = (125°C−25°C) / 165 = 606mW

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance θJA.

LP3984 Datasheet(PDF) 7 Page - Lowpower Semiconductor inc