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MPC8378ECVRALFA Datasheet(PDF) 89 Page - Freescale Semiconductor, Inc |
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MPC8378ECVRALFA Datasheet(HTML) 89 Page - Freescale Semiconductor, Inc |
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89 / 126 page  MPC8378E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 89 Package and Pin Listings Figure 66 shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package. Figure 66. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II Note: 1 All dimensions are in millimeters. 2 Dimensioning and tolerancing per ASME Y14. 5M-1994. 3 Maximum solder ball diameter measured parallel to Datum A. 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5 Parallelism measurement should exclude any effect of mark on top surface of package. 21.2 Pinout Listings Table 67 provides the pin-out listing for the TePBGA II package. Table 67. TePBGA II Pinout Listing Signal Package Pin Number Pin Type Power Supply Notes Clock Signals CLKIN K24 I OVDD — |
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