TLE8262E datasheet(9/93 Pages) INFINEON

No. de pieza	TLE8262E

Descripción Electrónicos	Universal System Basis Chip HERMES Rev. 1.0

PDF	93 Pages

Scroll/Zoom	100%

Fabricante Electrónico	INFINEON [Infineon Technologies AG]

Página de inicio	http://www.infineon.com

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9 / 93 page

Data Sheet

Rev. 1.0, 2009-03-31

TLE8262E

Pin Configuration

RxDLIN

LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 2.1

as well as SAE J2602-2; push-pull output; LOW in dominant state.

n.c.

Not connected

n.c.

Not connected

n.c.

Not connected

n.c.

Not connected

GND

Ground

n.c.

Not connected

n.c

not connected

Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals

coming from, for example, an external switch panel; also used as wake-up input;

Limp Home

Fail-Safe Function Output; Open drain. Active LOW.

Test

SBC SW Development Mode entry; Connect to GND for activation; Integrated pull-

up resistor. Connect to

S or leave open for normal operation.

EDP

Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.1)

1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed

die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC

performance.

Symbol

Function

TLE8262E Datasheet(PDF) 9 Page - Infineon Technologies AG