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AS1324

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VIN to GND

-0.3

7

V

SW, EN, FB to GND

-0.3

+ 0.3

V

Thermal Resistance

207.4

ºC/W

on PCB

ESD

2

kV

HBM MIL-Std. 883E 3015.7 methods

Latch-Up

-100

+100

mA

JEDEC 78

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+125

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages

is matte tin (100% Sn).

Junction Temperature

125

ºC

dissipation (PD) as:

(EQ 1)