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AS13985F12-T Datasheet(PDF) 3 Page - ams AG

No. de pieza AS13985F12-T
Descripción Electrónicos  Micropower 150mA Low-Noise LDO
PDF  12 Pages
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Fabricante Electrónico  AMSCO [ams AG]
Página de inicio  http://www.ams.com
Logo AMSCO - ams AG

AS13985F12-T Datasheet(HTML) 3 Page - ams AG

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AS13985
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
P(MAX) = (TJ(MAX) - (TAMB))/
ΘJA
(EQ 1)
Where:
The value of
ΘJA for the SOT23 package is 220ºC/W in a typical PC-board mounting.
The value of
ΘJA for the WLP package is 225ºC/W.
Note: Exceeding the maximum allowable dissipation will cause excessive device temperature and the regula-
tor will go into thermal shutdown.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Input Supply Voltage (Survival)
-0.3
+7
V
Input Supply Voltage (Operating)
+2.5
+5.5
V
Shutdown Input Voltage (Survival)
-0.3
+7
V
Output Voltage (Survival)
-0.3
+7
V
IOUT (Survival)
Short-circuit protected.
Input/Output Voltage (Survival)
1
1. The output PNP structure contains a diode between pins VIN and VOUT that is normally reverse-biased. revers-
ing the polarity of pins VIN and VOUT will activate this diode.
-0.3
+7
V
Power Dissipation
2
2. The maximum allowable power dissipation is a function of the maximum junction temperature (TJ(MAX), the
junction-to-ambient thermal resistance (
ΘJA), and the ambient temperature (TAMB). The maximum allowable
power dissipation at any ambient temperature is calculated as:
Internally limited.
Operating Junction Temperature
-40
+125
ºC
Storage Temperature Range
-65
+150
ºC
Package Body Temperature
+260
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).



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