ADV3222ARZ-R7 datasheet(6/20 Pages) AD

6 / 20 page

ADV3221/ADV3222

Rev. 0 | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

POWER DISSIPATION

Table 4.

Parameter

Rating

Supply Voltage (V+ − V−)

12 V

Analog Input Voltage

V− to V+

Digital Input Voltage

0 V to V+

Output Voltage (Disabled Output)

(V+ − 1 V) to (V− + 1 V)

Output Short-Circuit Duration

Momentary

Output Short-Circuit Current

50 mA

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

The ADV3221/ADV3222 are operated with ±5 V supplies and

can drive loads down to 150 Ω, resulting in a wide range of

possible power dissipations. For this reason, extra care must

be taken to adjust the operating conditions based on ambient

temperature.

Packaged in a 16-lead narrow-body SOIC, the ADV3221 and

ADV3222 junction-to-ambient thermal impedance (θJA) is 81°C/W.

For long-term reliability, the maximum allowed junction tempera-

ture of the die, TJ, should not exceed 125°C. Temporarily exceeding

this limit may cause a shift in parametric performance due to a

change in stresses exerted on the die by the package. Figure 4

shows the range of the allowed internal die power dissipations

that meet these conditions over the −40°C to +85°C ambient

temperature range. When using Figure 4, do not include the

external load power in the maximum power calculation, but

do include the load current through the die output transistors.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

1.50

1.25

1.00

0.75

0.50

AMBIENT TEMPERATURE (°C)

TJ = 125°C

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

16-Lead Narrow-Body SOIC

°C/W

Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature

ESD CAUTION

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