ADMP404

Preliminary Technical Data

Rev. PrH | Page 8 of 12

PCB LAND PATTERN LAYOUT

The recommended PCB land pattern for the ADMP404 should

be laid out to a 1:1 ratio to the solder pads on the microphone

package, as shown in Figure 9. Care should be taken to avoid

applying solder paste to the sound hole in the PCB. A suggested

solder paste stencil pattern layout is shown in Figure 10. The

diameter of the sound hole in the PCB should be larger than the

diameter of the sound port of the microphone. A minimum

diameter of 0.5 mm is recommended.

Ø1.55

Ø0.95

1.52

0.90

1.90

1.22

0.68

0.61

0.61

Figure 9. PCB Land Pattern Layout

1.22

2×

0.8 × 0.6

0.2 × 45

TYP

1.52mm

1.55/1.05 DIA.

0.225 CUT WIDTH (2×)

Figure 10. Suggested Solder Paste Stencil Pattern Layout