0

5

10

15

20

25

30

35

0

25

50

75

100

125

150

SignalingRate-Mbps

40

45

T =25°C,

Load=15pF,

AllChannels

A

5-VI

CC2

3.3-VI

CC2

3.3-VI

CC1

5-VI

CC1

0

5

10

15

20

25

30

35

40

45

0

25

50

75

100

125

150

SignalingRate-Mbps

T =25°C,

Load=15pF,

AllChannels

A

5-VI

CC2

3.3-VI

CC2

3.3-VI

CC1

5-VI

CC1

0

5

10

15

20

25

30

35

40

45

0

25

50

75

100

125

150

SignalingRate-Mbps

T =25°C,

Load=15pF,

AllChannels

A

5-VI

3.3-VI

0

5

10

15

20

25

30

35

40

45

-40

-25

-10

5

20

35

50

65

80

95

110

125

T -Free-AirTemperature- C

A

°

T =25°C,

Load=15pF,

AllChannels

A

C3.3-V

,t

pHL

t

pLH

M3.3-V

,t

pHL

t

pLH

C5-V

,t

pHL

t

pLH

M5-V

,t

pHL

t

pLH

ISO7240CF, ISO7240C, ISO7240M

ISO7241C, ISO7241M

ISO7242C, ISO7242M

SLLS868L – SEPTEMBER 2007 – REVISED JANUARY 2010

www.ti.com

THERMAL CHARACTERISTICS

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

Junction-to-air

°C/W

High-K Thermal Resistance

96.1

Junction-to-Board Thermal Resistance

61

°C/W

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

spacer

TYPICAL CHARACTERISTIC CURVES

ISO7240C/M RMS SUPPLY CURRENT

ISO7241C/M RMS SUPPLY CURRENT

vs

vs

SIGNALING RATE

SIGNALING RATE

Figure 7.

Figure 8.

ISO7242C/M RMS SUPPLY CURRENT

PROPAGATION DELAY

vs

vs

SIGNALING RATE

FREE-AIR TEMPERATURE

Figure 9.

Figure 10.

16

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Product Folder Link(s): ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M