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PBLS2002D Datasheet(PDF) 3 Page - NXP Semiconductors

No. de pieza PBLS2002D
Descripción Electrónicos  20 V PNP BISS loadswitch
PDF  16 Pages
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Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo NXP - NXP Semiconductors

PBLS2002D Datasheet(HTML) 3 Page - NXP Semiconductors

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PBLS2002D_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 27 August 2009
3 of 16
NXP Semiconductors
PBLS2002D
20 V PNP BISS loadswitch
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
TR2; NPN resistor-equipped transistor
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
50
V
VEBO
emitter-base voltage
open collector
-
10
V
VI
input voltage
positive
-
+30
V
negative
-
−10
V
IO
output current
-
100
mA
ICM
peak collector current
tp ≤ 300 µs
-
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
200
mW
Per device
Ptot
total power dissipation
[1] -
400
mW
[2] -
530
mW
[3] -
600
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
(1) Ceramic PCB, Al2O3, standard footprint
(2) FR4 PCB, mounting pad for collector 1cm2
(3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Tamb (°C)
0
160
120
40
80
006aaa414
0.4
0.2
0.6
0.8
Ptot
(W)
0
(1)
(2)
(3)



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