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PCF8564AU/10AA/1 Datasheet(PDF) 40 Page - NXP Semiconductors

No. de pieza PCF8564AU/10AA/1
Descripción Electrónicos  Real time clock and calendar
PDF  44 Pages
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Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8564AU/10AA/1 Datasheet(HTML) 40 Page - NXP Semiconductors

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PCF8564A_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 1 — 8 October 2009
40 of 44
NXP Semiconductors
PCF8564A
Real time clock and calendar
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
19.3.4 Cleaning
Cleaning can be done after reflow soldering.



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