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RUSBF110 Datasheet(PDF) 18 Page - Tyco Electronics |
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RUSBF110 Datasheet(HTML) 18 Page - Tyco Electronics |
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18 / 28 page ![]() 128 RoHS Compliant, ELV Compliant 10 Test Conditions Resistance Change Passive aging 70°C, 1000 hours ±5% 85°C, 1000 hours ±5% Humidity aging 85°C, 85%RH, 1000 hours ±5% Thermal shock 85°C, -40°C (10 times) ±5% Solvent resistance MIL-STD-202, Method 215F No change RUSBF Environmental Specifications Test Conditions Resistance Change Passive aging -40°C, 1000 hours ±5% 85°C, 1000 hours ±5% Humidity aging 85°C, 85%RH, 1000 hours ±5% Thermal shock 85°C, -40°C (10 times) ±5% Solvent resistance MIL-STD-202, Method 215F No change Lead material RGEF300 to RGEF1100 : Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm/0.032in. RGEF1200 to RGEF1400 : Tin-plated copper, 0.82mm2 (18AWG), ø1.0mm/0.04in. Soldering characteristics Solderability per ANSI/J-STD-002 Category 3 Solder heat withstand RGEF300 and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C RGEF500 to RGEF1400: per IEC 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0 Operation temperature -40°C~85°C Note: Devices are not designed to be placed through a reflow process. RGEF Physical Characteristics Environmental Specifications Test Conditions Resistance Change Passive aging 70°C, 1000 hours ±5% 85°C, 1000 hours ±5% Humidity aging 85°C, 85%RH, 1000 hours ±5% Thermal shock 125°C, -40°C (10 times) ±5% Solvent resistance MIL-STD-202, Method 215F No change Lead material RHEF050 to RHEF200 : Tin-plated copper clad steel, 0.205mm2 (24AWG), ø0.51mm/0.020in. RHEF300 to RHEF1100 : Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm/0.032in. RHEF1300 to RHEF1500 : Tin-plated copper, 0.82mm2 (18AWG), ø1.0mm/0.04in. Soldering characteristics Solderability per ANSI/J-STD-002 Category 3 Solder heat withstand per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ±5°C Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0 Operation temperature -40°C~125°C Note: Devices are not designed to be placed through a reflow process. RHEF Physical Characteristics Environmental Specifications Storage Conditions for Radial-leaded Devices Storage conditions 40°C max., 70% RH max.; devices should remain in original sealed bags prior to use. Devices may not meet specificed values if these storage conditions are exceeded. Note: For the TR devices series, see the telecommunications and networking devices section. Table R5 Physical Characteristics and Environmental Specifications for Radial-leaded Devices Cont’d |
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