TUSB9260

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SLLS962A – DECEMBER 2009 – REVISED JULY 2010

6.3

Oscillator

XI should be tied to the 1.8-V clock source and XO should be left floating.

VSSOSC should be connected to the PCB ground plane.

A 20-, 25-, 30-, or 40-MHz clock can be used.

Table 6-1. Oscillator Specification

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

VDDIO = 1.8 V,

XI input capacitance

0.414

pF

Low-level input voltage

0.35 x VDDR18

V

High-level input voltage

0.65 x VDDR18

V

Frequency tolerance

Operational temperature

–50

50

ppm

Duty cycle

45

50

55

%

Rise/Fall time

20% - 80 %

6

ns

0.8

ps

25

ps

Reference clock jitter

50

ps

(1)

Sigma value assuming Gaussian distribution

(2)

After application of JTF

(3)

(4)

Absolute phase jitter (p-p)

6.4

Crystal

A parallel, 20pF load capacitor should be used if a crystal source is used.

VSSOSC should not be connected to the PCB ground plane.

A 20-, 25-, 30-, or 40-MHz crystal can be used.

Table 6-2. Crystal Specification

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

Frequency tolerance

Operational temperature

–50

50

ppm

Frequency stability

1 year aging

–50

50

ppm

Load capacitance

12

20

24

pF

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CLOCK CONNECTIONS

17

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