ADG5436 datasheet(19/20 Pages) AD

19 / 20 page

ADG5436

Rev. 0 | Page 19 of 20

OUTLINE DIMENSIONS

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 36. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

2.70

2.60 SQ

2.50

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

0.65

BSC

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.45

0.40

0.35

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-16-17)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADG5436BRUZ

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG5436BRUZ-REEL7

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG5436BCPZ-REEL7

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-17

1 Z = RoHS Compliant Part.

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