TECHNICAL DATA SHEET

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Website: http: //www.microsemi.com

LDS-0160 Rev. 1 (100435)

Page 3 of 3

PACKAGE DIMENSIONS

NOTE:

Dimensions

1. Dimensions are in inches.

Ltr

Inches

Millimeters

2. Millimeters are given for general information only.

Min

Max

Min

Max

3. In accordance with ASME Y14.5M, diameters are equivalent to

Φx

BD

.094

.105

2.39

2.67

symbology.

BL

.189

.205

4.80

5.21

ECT

.016

.022

0.41

0.55

S

.001 min

0.03 min

FIGURE 1. Physical dimensions (DO-213AB).

DESIGN DATA

CASE: DO-213AB, Hermetically sealed glass case. (MELF, LL41).

LEAD FINISH: Tin / Lead

POLARITY: Diode to be operated with the banded (Cathode) end negative.

MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) of this device is approximately +6PPM/°C.

The COE of the Mounting Surface System should be selected to provide A suitable match with this device.

DO-213AB