MSP430L092

MSP430C09x

www.ti.com

SLAS673 – SEPTEMBER 2010

Absolute Maximum Ratings

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

–0.3 V to 1.90 V

–0.3 V to 1.90 V

±2.5 mA

0.9

–55°C to 150°C

ESD tolerance, Human-Body Model (HBM)

2000 V

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

The diode current increases to ±4.5 mA when two pins are connected, ± 6.75 mA for three pins.

(4)

Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow

temperatures not higher than classified on the device label on the shipping boxes or reels.

Recommended Operating Conditions

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage during program execution

0.9

1.65

V

Supply voltage (GND reference)

0

V

Operating free-air temperature

0

50

°C

470

nF

1

MHz

(1) (

System operating frequency

2)

4

MHz

(1)

The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the

specified maximum frequency.

(2)

Modules may have a different maximum input clock specification. Refer to the specification of the respective module in this data sheet.

Copyright © 2010, Texas Instruments Incorporated

Submit Documentation Feedback

21