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MS6894 Datasheet(PDF) 6 Page - MOSA ELECTRONICS

No. de pieza MS6894
Descripción Electrónicos  Mono 1.1W, Fully Differential Input Excellent PSRR, Low Voltage Operation Selectable Shutdown Logic Level
PDF  9 Pages
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Fabricante Electrónico  MOSA [MOSA ELECTRONICS]
Página de inicio  http://www.mosanalog.com
Logo MOSA - MOSA ELECTRONICS

MS6894 Datasheet(HTML) 6 Page - MOSA ELECTRONICS

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MOSA
MS6894
Mono 1.1W Fully Differential Power Amplifier with Shutdown Selection
REV 1
6/9
www.mosanalog.com
APPLICATION INFORMATION
Basic application example
2
R
L
5
3
4
SD Mode
-IN
BP
SD
+
+IN
Bias
V
DD
GND
1
7
6
10
+
-
-
+
Common
mode
9
1uF
100k
1uF
20k
R
F1
V
DD
20k
R
F2
-
0.39uF
20k
R
I1
MCU
V
DD
0.39uF
20k
+ Differential Input
R
I2
Vo2
Vo1
- Differential Input
Fig.1
A audio amplifier application circuit.
Shutdown Control
The shutdown may be enabled by either logic high or logic low that depending on shutdown mode selection. Both the
SD pin and the SD Mode pin are TTL compatible input. The SD Mode is logic low, the device entries shutdown when
SD is logic low. The SD Mode is logic high, the device entries shutdown when SD is logic high.
External gain-setting
As shown in Fig.1, RI1 =RI2 and RF1 =RF2, the respective closed-loop gain is set at -RF/RI. It is important to match input
resistors and feedback resistors to each other. The outputs are used to drive the mono bridged-tied load (BTL).
High Pass Filter
The input capacitor CIN and resister RIN are decided the cut-off frequency of the HPF. The equation is as follows:
fcut-off = 1 / (2π*RIN *CIN)
Thermal pad considerations
The thermal pad must be connected to ground. The package with thermal pad of the MS6894 requires special attention
on thermal design. The thermal pad on the bottom of the MS6894 should be soldered down to a copper pad on the
circuit board. Heat can be conducted away from the thermal pad through the copper plane to ambient. If the copper
plane is not on the top surface of the circuit board, 9 vias of 13 mil or smaller in diameter should be used to thermally
couple the thermal pad to the bottom plane. For good thermal conduction, the vias must be plated through and solder
filled.



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