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SIC403 Datasheet(PDF) 16 Page - Vishay Siliconix |
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SIC403 Datasheet(HTML) 16 Page - Vishay Siliconix |
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16 / 25 page ![]() www.vishay.com 16 Document Number: 66550 S11-1638-Rev. B, 15-Aug-11 Vishay Siliconix SiC403 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Capacitor Selection The output capacitors are chosen based on required ESR and capacitance. The maximum ESR requirement is controlled by the output ripple requirement and the DC tolerance. The output voltage has a DC value that is equal to the valley of the output ripple plus 1/2 of the peak-to-peak ripple. Change in the output ripple voltage will lead to a change in DC voltage at the output. The design goal is that the output voltage regulation be ± 4 % under static conditions. The internal 500 mV reference tolerance is 1 %. Allowing 1 % tolerance from the FB resistor divider, this allows 2 % tolerance due to VOUT ripple. Since this 2 % error comes from 1/2 of the ripple voltage, the allowable ripple is 4 %, or 42 mV for a 1.05 V output. The maximum ripple current of 4.4 A creates a ripple voltage across the ESR. The maximum ESR value allowed is shown by the following equations. The output capacitance is usually chosen to meet transient requirements. A worst-case load release, from maximum load to no load at the exact moment when inductor current is at the peak, determines the required capacitance. If the load release is instantaneous (load changes from maximum to zero in < 1 µs), the output capacitor must absorb all the inductor's stored energy. This will cause a peak voltage on the capacitor according to the following equation. Assuming a peak voltage VPEAK of 1.150 (100 mV rise upon load release), and a 10 A load release, the required capacitance is shown by the next equation. If the load release is relatively slow, the output capacitance can be reduced. At heavy loads during normal switching, when the FB pin is above the 750 mV reference, the DL output is high and the low-side MOSFET is on. During this time, the voltage across the inductor is approximately - VOUT. This causes a down-slope or falling di/dt in the inductor. If the load dI/dt is not much faster than the - dI/dt in the inductor, then the inductor current will tend to track the falling load current. This will reduce the excess inductive energy that must be absorbed by the output capacitor, therefore a smaller capacitance can be used. The following can be used to calculate the needed capacitance for a given dILOAD/dt: Peak inductor current is shown by the next equation. ILPK = IMAX + 1/2 x IRIPPLEMAX ILPK = 6 + 1/2 x 2.9 = 7.45 A Rate of change of load current = dILOAD/dt IMAX = maximum load release = 6 A Example This would cause the output current to move from 10 A to zero in 4 µs as shown by the following equation. Note that COUT is much smaller in this example, 254 µF compared to 328 µF based on a worst-case load release. To meet the two design criteria of minimum 254 µF and maximum 9 m ESR, select two capacitors rated at 150 µF and 18 m ESR. It is recommended that an additional small capacitor be placed in parallel with COUT in order to filter high frequency switching noise. Stability Considerations Unstable operation is possible with adaptive on-time controllers, and usually takes the form of double-pulsing or ESR loop instability. Double-pulsing occurs due to switching noise seen at the FB input or because the FB ripple voltage is too low. This causes the FB comparator to trigger prematurely after the 250 ns minimum off-time has expired. In extreme cases the noise can cause three or more successive on-times. Double-pulsing will result in higher ripple voltage at the output, but in most applications it will not affect operation. This form of instability can usually be avoided by providing the FB pin with a smooth, clean ripple signal that is at least 10 mVp-p, which may dictate the need to increase the ESR of the output capacitors. It is also imperative to provide a proper PCB layout as discussed in the Layout Guidelines section. ESRMAX = VRIPPLE IRIPPLEMAX ESRMAX = 9.5 m Ω = 42 mV 2.9 A COUT_MIN = L (IOUT + x IRIPPLEMAX)2 (VPEAK)2 - (VOUT)2 1 2 COUT_MIN = 1.3 µH (6 + x 2.9)2 (1.15)2 - (1.05)2 COUT_MIN = 328 µF 1 2 COUT = ILPK x L x - x dt 2 (VPK - VOUT) ILPK VOUT IMAX dlLOAD Load dlLOAD dt = 2.5 A µs COUT = 7.45 x 1.3 µH x - x 1 µs 2 (1.15 - 1.05) 7.45 1.05 6 2.5 COUT = 254 µF |
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