ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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www.diodes.com

Suggested Pad Layout

© Diodes Incorporated

U-DFN2626-10

Dimensions

Value

(in mm)

C

0.500

X

0.300

X1

2.250

X2

2.300

Y

0.600

Y1

1.360

Y2

3.000

U-DFN3016-12

Dimensions

Value

(in mm)

C

0.500

X

0.300

X1

2.800

X2

2.250

Y

0.600

Y1

0.450

Y2

2.050

W-DFN3020-8

Type B

Dimensions Value (in mm)

C

0.650

G

0.285

G1

0.090

X

0.400

X1

1.120

Y

0.730

Y1

0.500

Y2

0.365

Pin1

X2

Y2

C

X

Y

Y1

X1

Y2

Y1

X1

X2

Y

(12x)

CX

(12x)

C

X1

G1

X

Y1

Y

Y2

G