MBR2H100 datasheet(1/3 Pages) TAYCHIPST

No. de pieza	MBR2H100

Descripción Electrónicos	Surface Mount Schottky Power Rectifier

PDF	3 Pages

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Fabricante Electrónico	TAYCHIPST [Shenzhen Taychipst Electronic Co., Ltd]

Página de inicio	http://www.taychipst.com

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100V

2.0A

MBR2H100

Web Site: www.taychipst.com

FEATURES

E-mail: sales@taychipst.com

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

MECHANICAL DATA

• Guardring for Stress Protection

• Low Forward Voltage

• 175°C Operating Junction Temperature

• Epoxy Meets UL 94 V−0

• Package Designed for Optimal Automated Board Assembly

• ESD Ratings: Machine Model, C

Human Body Model, 3B

• This is a Pb−Free Device

• Reel Options: MBR2H100SFT3G = 10,000 per 13 in reel/8 mm tape

• Device Marking: L2H

• Polarity Designator: Cathode Band

• Weight: 11.7 mg (approximately)

• Case: Epoxy, Molded

• Lead Finish: 100% Matte Sn (Tin)

• Lead and Mounting Surface Temperature for Soldering Purposes:

260

°C Max. for 10 Seconds

• Device Meets MSL 1 Requirements

Surface Mount Schottky Power Rectifier

SOD-123FL

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

VR

100

V

Average Rectified Forward Current

(TL = 146°C)

IO

2.0

A

Non−Repetitive Peak Surge Current

(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)

IFSM

50

A

Storage and Operating Junction Temperature Range (Note 1)

Tstg, TJ

−65 to +175

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The heat generated must be less than the thermal conductivity from

Junction−to−Ambient: dPD/dTJ < 1/RqJA.

THERMAL CHARACTERISTICS

Characteristic

Symbol

Value

Unit

Thermal Resistance, Junction−to−Lead (Note 2)

YJCL

23

°C/W

Thermal Resistance, Junction−to−Ambient (Note 2)

RqJA

85

°C/W

Thermal Resistance, Junction−to−Ambient (Note 3)

RqJA

330

°C/W

2. Mounted with 700 mm2 copper pad size (Approximately 1 in2) 1 oz FR4 Board.

3. Mounted with pad size approximately 20 mm2 copper, 1 oz FR4 Board.

4. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2.0%.

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