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AD6622S/PCB Datasheet(PDF) 27 Page - Analog Devices |
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AD6622S/PCB Datasheet(HTML) 27 Page - Analog Devices |
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27 / 28 page ![]() AD6622 –27– REV. 0 Driving Multiple TSP Serial Ports When properly configured, the AD6622 will drive each SDFS out of phase. Each new piece of data should be driven only into the TSP that pulses its SDFS pin at that time. In the UMTS example, L = 64 and NTSP = 4, so each serial port need only accept every 4th input sample. Each serial port is shifting at peak capacity, so sample 1, 2, and 3 begin shifting into Serial Ports B, C, and D before Sample 0 is completed into Serial Port A. 0 1 2 3 4 5 6 7 SDFSA SDFSB SDFSC SDFSD Figure 21. SDFS Timing for WBCDMA RAM COEF FILTER CIC NCO I Q 8.196MSPS 65.536MSPS 4.096 MCPS 1.024 MCPS 32 1.024 MCPS 32 1.024 MCPS 1.024 MCPS 65.536 MSPS DAC COMPLEX SIGNAL 32 BITS (16 I, 16 Q) REAL OR IMAGINARY SIGNAL AD6622 32 32 32 RAM COEF FILTER CIC NCO I Q 8.196MSPS 65.536MSPS RAM COEF FILTER CIC NCO I Q 8.196MSPS 65.536MSPS RAM COEF FILTER CIC NCO I Q 8.196MSPS 65.536MSPS Figure 22. Block Diagram for WBCDMA 0 5 10 15 20 0 0.5 1.0 25 30 COEF – J Figure 23. Typical Impulse Response for WBCDMA –70 –60 –50 –40 –30 –20 –10 0 10 –100 –90 –80 RAM COEFFICIENT FILTER 0 1000 2000 3000 4000 5000 6000 7000 8000 kHz Figure 24. Typical FIR Frequency Response for WBCDMA –70 –60 –50 –40 –30 –20 –10 0 –100 –90 –80 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 –110 –120 dB(AD6624(f)) dB () HCIC(f) LEVEL5 SPEC( f ) 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 f MHz Figure 25. Typical Composite Frequency Response for WBCDMA THERMAL MANAGEMENT The power dissipation of the AD6622 is primarily determined by three factors: the clock rate, the number of channels active, and the distribution of interpolation rates. The faster the clock rate the more power dissipated by the CMOS structures of the AD6622; the more channels active, the higher the overall power of the chip. Low interpolation rates in the CIC stages (CIC5, CIC2) results in higher power dissipation. All these factors should be analyzed as each application has different thermal requirements. The AD6622 128-lead MQFP is specially designed to provide excellent thermal performance. To achieve the best performance, the power and ground leads should be connected directly to planes on the PC board. This provides the best thermal transfer from the AD6622 to the PC board. |
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