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OPA313IDBVT Datasheet(PDF) 8 Page - Texas Instruments |
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OPA313IDBVT Datasheet(HTML) 8 Page - Texas Instruments |
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8 / 36 page ![]() 1 2 3 4 14 13 12 11 OUTD - IND +IND V - OUTA - INA +INA V+ 5 6 7 10 9 8 +INC - INC OUTC +INB - INB OUTB A B D C OUTA -INA +INA V- 1 2 3 4 V+ OUTB -INB +INB 8 7 6 5 Exposed Thermal DiePad on Underside (2) 1 2 3 5 4 V+ - IN OUT V - +IN 1 2 3 4 8 7 6 5 V+ OUTB - INB +INB OUTA - INA +INA V - 1 2 3 5 4 V+ OUT +IN V - - IN OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com PIN CONFIGURATIONS DCK PACKAGE D, DGK PACKAGES SC70-5 SO-8, MSOP-8 (TOP VIEW) (TOP VIEW) DBV PACKAGE SOT23-5 (TOP VIEW) DRG PACKAGE(1) DFN-8 (TOP VIEW) PW PACKAGE TSSOP-14 (TOP VIEW) (1) Pitch: 0,65 mm. (2) Connect thermal pad to V–. Pad size: 1,8 mm × 1,5 mm. 8 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 |
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