Data Sheet

ADAU7002

Rev. 0 | Page 13 of 16

OUTLINE DIMENSIONS

Figure 21. 8-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-8-6)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package

Option

Branding

ADAU7002ACBZ-R7

−40°C to +85°C

8-Ball Wafer Level Chip Scale Package [WLCSP], 7”Tape and Reel

CB-8-6

BE

ADAU7002ACBZ-RL

−40°C to +85°C

8-Ball Wafer Level Chip Scale Package [WLCSP], 13”Tape and Reel

CB-8-6

BE

EVAL-ADAU7002Z

Evaluation Board

1

Z = RoHS Compliant Part.

A

B

C

D

0.560

0.500

0.440

0.230

0.200

0.170

0.330

0.300

0.270

0.800

0.760

0.720

1.600

1.560

1.520

1

2

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.3000

0.260

0.220

1.20

REF

0.40

BSC

0.40 BSC

BALL A1

IDENTIFIER

ORIENTATION

IDENTIFIER

SEATING

PLANE

COPLANARITY

0.05