 2002-2012 Microchip Technology Inc.

DS21453D-page 9

TC682

6.3

Package Dimensions

3° Min.

Pin 1

.260 (6.60)

.240 (6.10)

.045 (1.14)

.030 (0.76)

.070 (1.78)

.040 (1.02)

.400 (10.16)

.348 (8.84)

.200 (5.08)

.140 (3.56)

.150 (3.81)

.115 (2.92)

.110 (2.79)

.090 (2.29)

.022 (0.56)

.015 (0.38)

.040 (1.02)

.020 (0.51)

.015 (0.38)

.008 (0.20)

.310 (7.87)

.290 (7.37)

.400 (10.16)

.310 (7.87)

8-Pin Plastic DIP

Dimensions: inches (mm)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

.050 (1.27) Typ.

8

Pin 1

.244 (6.20)

.228 (5.79)

.157 (3.99)

.150 (3.81)

.197 (5.00)

.189 (4.80)

.020 (0.51)

.013 (0.33)

.010 (0.25)

.004 (0.10)

.069 (1.75)

.053 (1.35)

.010 (0.25)

.007 (0.18)

.050 (1.27)

.016 (0.40)

8-Pin SOIC

Dimensions: inches (mm)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging