M24C64-R datasheet(38/42 Pages) STMICROELECTRONICS

No. de pieza	M24C64-R

Descripción Electrónicos	64-Kbit serial I2C bus EEPROM

PDF	42 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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38 / 42 page

Package mechanical data

M24C64-W M24C64-R M24C64-F M24C64-DF

38/42

Doc ID 16891 Rev 27

Figure 21.

Thin WLCSP 8-bump wafer-length chip-scale package outline

Drawing is not to scale.

The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).

Table 23.

Thin WLCSP 8-bump wafer-length chip-scale package mechanical data(1)

These data are preliminary.

Symbol

millimeters

inches(2)

Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

0.315

0.300

0.330

0.0124

0.0118

0.0130

0.115

0.0045

0.200

0.0079

b(3)

Dimension measured at the maximum bump diameter parallel to primary datum Z.

0.160

0.0063

1.073

1.093

0.0422

0.0430

0.959

0.979

0.0378

0.0385

0.693

0.0273

0.800

0.0315

0.400

0.0157

0.133

0.0052

0.137

0.00524

aaa

0.110

0.0043

eee

0.060

0.0043

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