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ICS574MLFT Datasheet(PDF) 3 Page - Integrated Device Technology

No. de pieza ICS574MLFT
Descripción Electrónicos  ZERO DELAY, LOW SKEW BUFFER
PDF  7 Pages
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Fabricante Electrónico  IDT [Integrated Device Technology]
Página de inicio  http://www.idt.com
Logo IDT - Integrated Device Technology

ICS574MLFT Datasheet(HTML) 3 Page - Integrated Device Technology

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ICS574
ZERO DELAY, LOW SKEW BUFFER
ZDB
IDT™/ ICS™ ZERO DELAY, LOW SKEW BUFFER
3
ICS574
REV G 051310
External Components
The ICS574 requires a minimum number of external components for proper operation. Decoupling capacitors of
0.1µF should be connected between VDD and GND on pins 4 and 5, as close to the device as possible. A series
termination resistor of 33
Ω may be used close to the pin for each clock output to reduce reflections.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS574. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Rating
Supply Voltage, VDD (referenced to ground)
-0.5 V to 7 V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Electrostatic Discharge (MIl-STD-883)
2000 V (minimum)
Ambient Operating Temperature
-40
° C to +85° C
Soldering Temperature (10 seconds max.)
260
° C
Junction Temperature
150
° C
Storage Temperature
-65 to +150
° C



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