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MB2S Datasheet(PDF) 1 Page - Kingtronics International Company

No. de pieza MB2S
Descripción Electrónicos  Single Phase 0.8 AMPS. Glass Passivated Bridge Rectifiers Voltage Range 200 to 1000 Volts Current 0.8 Amperes
PDF  2 Pages
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Fabricante Electrónico  KINGTRONICS [Kingtronics International Company]
Página de inicio  http://www.kingtronics.com
Logo KINGTRONICS - Kingtronics International Company

MB2S Datasheet(HTML) 1 Page - Kingtronics International Company

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Website: www.kingtronics.com
Email: info@kingtronics.com
Tel: (852) 8106 7033
Fax: (852) 8106 7099
1
MB2S THRU MB10S
Single Phase 0.8 AMPS. Glass Passivated Bridge Rectifiers
Voltage Range 200 to 1000 Volts Current 0.8 Amperes
FEATURES
Ideal for printed circuit board
Reliable low cost construction technique
results in inexpensive product
High temperature soldering guaranteed:
260
/ 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension
UL Recognized File number: E347214
MECHANICAL DATA
Case: Molded plastic
Lead: solder plated
Polarity: As marked
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.For capacitive load, derate current by 20%
SYMBOLS
MB2S
MB4S
MB6S
MB8S
MB10S
UNITS
Maximum Repetitive Peak Reverse Voltage
VRRM
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
140
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
200
400
600
800
1000
V
Maximum Average Forward Rectified Current
On glass-epoxy P.C.B.
On aluminum substrate
I(AV)
0.5
0.8
A
Peak Forward Surge Current,
8.3ms Single Half Sine-wave Superimposed on
Rated Load (JEDEC method )
IFSM
35
A
Maximum Instantaneous Forward Voltage at 0.4A
VF
1.0
V
Maximum DC Reverse Current @ TA=25℃
Rated DC Blocking voltage per leg TA=125℃
IR
5.0
500
μA
Typical Thermal Resistance (Note1)
(Note2)
RθJA
RθJL
70
20
/W
Operating Temperature Range
TJ
-55 to +150
Storage Temperature Range
TSTG
-55 to +150
Note:
1.On aluminum suvstrate P.C.B. with an area of 0.8×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad.
2. Thermal Resistance from Junction to Case with units Mounted on 2.6×1.4×0.06”Thick(6.5×3.5×0.15cm)Al.Plate.


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