STM32F100RC datasheet(38/98 Pages) STMICROELECTRONICS

38 / 98 page

Electrical characteristics

STM32F100xC, STM32F100xD, STM32F100xE

38/98

Doc ID 15081 Rev 7

Note:

It is recommended to power VDD and VDDA from the same source. A maximum difference of

300 mV between VDD and VDDA can be tolerated during power-up and operation

5.3.2

Operating conditions at power-up / power-down

Subject to general operating conditions for TA.

Table 10.

Operating conditions at power-up / power-down

Power dissipation at TA =

85 °C for suffix 6 or TA =

105 °C for suffix 7(2)

LQFP144

666

LQFP100

434

LQFP64

444

Ambient temperature for 6

suffix version

Maximum power dissipation

–40

°C

Low power dissipation(3)

–40

105

Ambient temperature for 7

suffix version

Maximum power dissipation

–40

105

°C

Low power dissipation(3)

–40

125

Junction temperature range

6 suffix version

–40

105

°C

7 suffix version

–40

125

When the ADC is used, refer to Table 51: ADC characteristics.

If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 6.2:

Thermal characteristics on page 92).

In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Section 6.2: Thermal characteristics on page 92).

Table 9.

General operating conditions (continued)

Symbol

Parameter

Conditions

Min

Max

Unit

Symbol

Parameter

Min

Max

Unit

tVDD

VDD rise time rate

∞

µs/V

VDD fall time rate

∞

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