Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

MF-USMF Series - PTC Resettable Fuses

Product Dimensions

DIMENSIONS:

MM

(INCHES)

Model

AB

C

D

Min.

Max.

Min.

Max.

Min.

Max.

Min.

MF-USMF005

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.80

(0.031)

1.1

(0.043)

0.30

(0.012)

MF-USMF010

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.80

(0.031)

1.1

(0.043)

0.30

(0.012)

MF-USMF020

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.80

(0.031)

1.1

(0.043)

0.30

(0.012)

MF-USMF035

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.55

(0.022)

0.85

(0.033)

0.30

(0.012)

MF-USMF050

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.55

(0.022)

0.85

(0.033)

0.30

(0.012)

MF-USMF075

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.55

(0.022)

0.85

(0.033)

0.30

(0.012)

MF-USMF110

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.55

(0.022)

0.85

(0.033)

0.30

(0.012)

MF-USMF150

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.40

(0.016)

0.85

(0.033)

0.30

(0.012)

MF-USMF175X

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.40

(0.016)

0.85

(0.033)

0.30

(0.012)

Packaging: 3000 pcs. per reel.

Terminal material:

Electroless Ni under immersion Au

Termination pad solderability:

Standard Au finish:

Meets ANSI/J-STD-002 Category 2.

Recommended Storage:

40 °C max./70 % RH max.

A

B

C

Top and Bottom View

Side View

D

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Solder Reflow Recommendations

Notes:

•

MF-USMF models cannot be wave soldered.

•

If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

•

Compatible with Pb and Pb-free solder reflow profiles.

•

Excess solder may cause a short circuit, especially during hand

Recommendation guidelines.

Recommended Pad Layout

2.5 ± 0.1

(.098 ± .004)

2.0 ± 0.1

(.079 ± .004)

1.0 ± 0.05

(.039 ± .002)

1.0 ± 0.05

(.039 ± .002)