PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins

Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

CDC339DB

ACTIVE

SSOP

DB

20

70

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CDC339DBG4

ACTIVE

SSOP

DB

20

70

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CDC339DBG4

ACTIVE

SSOP

DB

20

70

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CDC339DBLE

OBSOLETE

SSOP

DB

20

TBD

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CDC339DBLE

OBSOLETE

SSOP

DB

20

TBD

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CDC339DW

ACTIVE

SOIC

DW

20

25

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CDC339DW

ACTIVE

SOIC

DW

20

25

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CDC339DWG4

ACTIVE

SOIC

DW

20

25

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CDC339DWG4

ACTIVE

SOIC

DW

20

25

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CDC339NSR

OBSOLETE

SO

NS

20

TBD

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CDC339NSR

OBSOLETE

SO

NS

20

TBD

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CDC339NSRG4

OBSOLETE

SO

NS

20

TBD

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CDC339NSRG4

OBSOLETE

SO

NS

20

TBD

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ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.