RC2012 datasheet(39/40 Pages) SAMSUNG

No. de pieza	RC2012

Descripción Electrónicos	THICK-FILM CHIP RESISTOR

PDF	40 Pages

Scroll/Zoom	100%

Fabricante Electrónico	SAMSUNG [Samsung semiconductor]

Página de inicio	http://www.samsung.com/Products/Semiconductor

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39 / 40 page

ISO / TS 16949

ISO 14001

OHSAS 18001

QC080000

2012 - 04 - 27

2009 - 04 - 28

02109E110143R2L

CCCI

02109S10088R2L

Date

Validity

Number

Certification

Section

High Tech(China)

Authority

Date

Validity

Number

Authority

Date

Validity

Number

Authority

Date

Validity

Number

Authority

2009 - 04- 28

2012 - 04 - 27

PRC-HSPM-1766

2010 - 07 - 27

2013 - 07 - 26

BSI

CCCI

TS 91430-008

2011 - 11 - 29

2014 - 11 - 28

Quality System Certification List

Table 1:Certification list of Samsung Factory

ISO/TS 16949

ISO 14001

OHSAS 18001

QC080000

Operation

Notes

Example of land

Pattern Design

Recommended

Soldering Conditions

General Structure

General

Precision

Jumper

Low ohms

(RC Series)

Low ohms

(RUT Series)

Ultra Low Ohms

(RU Series)

Ultra Low Ohms

(RUK Series)

Ultra Low Ohms

(RUW Series)

Arrays

(CONVEX Type)

Arrays

(CONCAVE Type)

Arrays

(FLAT Type)

Arrays for

Memory Modules

Attenuator

Characteristics

Performance

Packaging

Standard

Resistance Value

RC2012 Datasheet(PDF) 39 Page - Samsung semiconductor

RC2012 Datasheet(HTML) 39 Page - Samsung semiconductor

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