TLP708,TLP708F

2012-08-07

8

PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &

GENERAL STORAGE

(1) Precautions for Soldering

1) When Using Soldering Reflow

An example of a temperature profile when Sn-Pb eutectic solder is used:

An example of a temperature profile when lead(Pb)-free solder is used:

Reflow soldering should be performed no more than twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering flow (Applicable to both eutectic solder and lead (Pb)-free solder)

Apply preheating of 150

Mounting condition of 260

Flow soldering should be performed no more than once.

3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Complete soldering within 10 seconds for lead temperature not exceeding 260

not exceeding 350

Heating by soldering iron should be performed no more than once per lead.

( °C )

( °C )