2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm

ILCX09 Series

09/23/13_B

Specifications subject to change without notice

Page 2

Pb Free Solder Reflow Profile:

Typical Circuit:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = 1

Termination = e4 (Au over Ni over W base metal).

Tape and Reel Information:

Environmental Specifications

Thermal Shock

MIL-STD-883, Method 1011, Condition A

Moisture Resistance

MIL-STD-883, Method 1004

Mechanical Shock

MIL-STD-883, Method 2002, Condition B

Mechanical Vibration

MIL-STD-883, Method 2007, Condition A

Resistance to Soldering Heat

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Hazardous Substance

Pb-Free / RoHS / Green Compliant

Solderability

JESD22-B102-D Method 2 (Preconditioning E)

Terminal Strength

MIL-STD-883, Method 2004, Test Condition D

Gross Leak

MIL-STD-883, Method 1014, Condition C

Fine Leak

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

Solvent Resistance

MIL-STD-202, Method 215

Marking

Line 1: ILSI, Date Code (yww)

Line 2: Frequency

Quantity per

Reel

1000

A

16 +/-.3

B

8 +/-.2

C

7.5 +/-.2

D

17.5 +/-1

E

50 / 60 / 80

F

180 / 250