MP2482DN datasheet(2/14 Pages) MPS

2 / 14 page

MP2482 – 5A, 30V, 420kHZ STEP-DOWN CONVERTER

MP2482 Rev.1.4

www.MonolithicPower.com

9/21/2011

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

Preliminary Specifications Subject to Change

ORDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature(TA)

MP2482DN*

SOIC8E

MP2482DN

MP2482DS**

SOIC8

MP2482DS

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (eg. MP2482DN–Z).

For RoHS Compliant Packaging, add suffix –LF (eg. MP2482DN–LF–Z)

** For Tape & Reel, add suffix –Z (eg. MP2482DS–Z).

For RoHS Compliant Packaging, add suffix –LF (eg. MP2482DS–LF–Z)

PACKAGE REFERENCE

BST

VCC

GND

EN/SYNC

TOP VIEW

EXPOSED PAD

ON BACKSIDE

SOIC8E

TOP VIEW

BST

VCC

GND

EN/SYNC

SOIC8

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 32V

VSW.........................-0.3V(-5V for < 10ns) to 33V

VBS ....................................................... VSW + 6V

All Other Pins..................................-0.3V to +6V

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8E...................................................... 2.5W

SOIC8 ........................................................ 1.4W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature............... -65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 30V

Operating Junct. Temp (TJ)...... -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8E...................................50 ...... 10 ...

°C/W

SOIC8…………………………..90……45…

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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