BAT54AP6FILM datasheet(4/13 Pages) STMICROELECTRONICS

4 / 13 page

Characteristics

BAT54

4/13

Doc ID 5505 Rev 10

Figure 11.

Relative variation of thermal impedance junction to ambient versus pulse duration

Figure 7.

Thermal resistance junction to

ambient versus copper surface

under each lead (SOD-323)

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOD-323)

200

300

400

500

600

th(j-a)(°C/W)

Epoxy FR4

CU=35 µm

SCU(mm²)

1.E-03

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

th(j-a)/Rth(j-a)

Single pulse

SOD323

Epoxy FR4

CU=2.25 mm²

CU=35 µm

tP(s)

Figure 9.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOT-23)

Figure 10.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOD-523)

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

th(j-a)/Rth(j-a)

Alumine substrate

10 x 8 x 0.5 mm

Single pulse

SOT23

tP(s)

1.E-03

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

th(j-a)/Rth(j-a)

Single pulse

SOD523

Epoxy FR4

CU=35 µm

tP(s)

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

th(j-a)/Rth(j-a)

Single pulse

SOT666

Epoxy FR4

CU=35 µm

tP(s)

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