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AOZ3013PI Datasheet(PDF) 2 Page - Alpha & Omega Semiconductors

No. de pieza AOZ3013PI
Descripción Electrónicos  Plastic Encapsulated Device
PDF  5 Pages
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Fabricante Electrónico  AOSMD [Alpha & Omega Semiconductors]
Página de inicio  http://www.aosmd.com
Logo AOSMD - Alpha & Omega Semiconductors

AOZ3013PI Datasheet(HTML) 2 Page - Alpha & Omega Semiconductors

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This AOS product reliability report summarizes the qualification result for AOZ3013PI (epad SO8
package).
Review of the electrical test results confirm that AOZ3013PI passed AOS quality and reliability
requirements for product manufacturing release (RTM). The continuous qualification testing and
reliability monitoring program ensure that all outgoing products will continue to meet AOS quality and
reliability standards.
Table of Contents:
I.
Product Description
II.
Package and Die information
III.
Qualification Test Requirements
IV.
Qualification Tests Result
V.
Reliability Evaluation
VI.
Revision History
I.
Product Description:
AOZ3013PI is high efficiency, simple to use, 3A synchronous buck regulator.
AOZ3013PI are Au&Cu mixed bonding wire version of AOZ3011PI product. Both are derivatives of AOZ105x
product family and AOZ103x product family with improved manufacturability – updated LX pad location to
eliminate down bonding.
AOZ3013PI works from a 4.5V to 18V input voltage range, and output voltage adjustable down to 0.8V. It is
offered in epad SO-8 package.
Absolute Maximum Ratings
Parameter
Supply Voltage (VIN)
20V
LX to AGND
-0.7V to VIN+0.3 V
LX to AGND
-5V to 22V(20ns)
EN to AGND
-0.3V to VIN+0.3 V
FB to AGND
-0.3V to 6 V
COMP to AGND
-0.3V to 6 V
PGND to AGND
-0.3V to 0.3 V
Junction Temperature (TJ)
+150°C
Storage Temperature (TS)
-65°C to +150°C
Thermal Characteristics
Package Thermal Resistance (
ΘJA)
50°C/W (typ.)
II.
Package and Die Information:
Product ID
AOZ3013PI (epad SO-8)
Process
UMC 5V/20V 2P3M 23BV
Lead Frame
A194FH
Die Attach
8006NS(WBC)/ 84-3J (controller IC) / 84-1 LMISR4
Bond wire
Au&Cu
Mold Material
G630AY
MSL
Level 2



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