L6747A

Pin information and thermal data

Doc ID 17126 Rev 1

5/15

2.2

Thermal data

Table 3.

Thermal data

8UGATE

High-side driver output.

Connect to high-side MOSFET gate. A small series resistor may be used to

control the PHASE pin negative spike.

-TH. PAD

Thermal pad connects the silicon substrate and makes good thermal contact

with the PCB. Connect to the PGND plane.

Table 2.

Pin descriptions (continued)

Pin #

Name

Function

Symbol

Parameter

Value

Unit

Thermal resistance junction-to-ambient

(device soldered on 2s2p, 67mm x 69mm board)

45

°C/W

Thermal resistance junction-to-case

5

°C/W

Maximum junction temperature

150

°C

Storage temperature range

0 to 150

°C

Junction temperature range

0 to 125

°C

Maximum power dissipation at 25°C

(device soldered on 2s2p,67mm x 69mm board)

2.25

W