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RC2012 Datasheet(PDF) 2 Page - Samsung semiconductor

No. de pieza RC2012
Descripción Electrónicos  Passive components sales offices
PDF  20 Pages
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Fabricante Electrónico  SAMSUNG [Samsung semiconductor]
Página de inicio  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

RC2012 Datasheet(HTML) 2 Page - Samsung semiconductor

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Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Anti-Sulfur
Resistors
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
CONTENTS
Operation Notes
Example of Land Pattern Design
Recommended Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms(RUT Series)
Ultra Low Ohms(RU Series)
Ultra Low Ohms(RUK Series)
Ultra Low Ohms(RJ Series)
Arrays(CONVEX Type)
Arrays(CONCAVE Type)
Arrays(FLAT Type)
Anti-Sulfur Resistors
Attenuator
Characteristics Performance
Packaging
Standard Resistance Value
We, Samsung, declare that our component Chip Resistor is produced in accordance
with EU RoHS directive.
1. RoHS Compliance and restriction of Br
The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.
- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos
- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
2. No use of materials breaking Ozone layer
The following ODS materials are not used in our fabrication process.
- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC
If you want more detailed Information,Please Visit Samsung Electro-mechanics Website
[http://www.sem.samsung.com, http://www.semlcr.com]
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