LP38853_14 datasheet(5/27 Pages) TI1

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LP38853

www.ti.com

SNVS335C – DECEMBER 2006 – REVISED SEPTEMBER 2011

Electrical Characteristics (continued)

Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF,

CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction

temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical

correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes

only.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

AC Parameters

VIN = VOUT(NOM) + 1V,

f = 120 Hz

PSRR

Ripple Rejection for VIN Input

(VIN)

Voltage

VIN = VOUT(NOM) + 1V,

f = 1 kHz

VBIAS = VOUT(NOM) + 3V,

f = 120 Hz

PSRR

Ripple Rejection for VBIAS Voltage

(VBIAS)

VBIAS = VOUT(NOM) + 3V,

f = 1 kHz

Output Noise Density

f = 120 Hz

µV/

√Hz

BW = 10 Hz

− 100 kHz

150

Output Noise Voltage

µVRMS

BW = 300 Hz

− 300 kHz

Thermal Parameters

Thermal Shutdown Junction

TSD

160

Temperature

°C

TSD(HYS)

Thermal Shutdown Hysteresis

TO-220-7

Thermal Resistance, Junction to

θJ-A

DDPAK-7

Ambient(5)

SO PowerPAD-8

168

°C/W

TO-220-7

Thermal Resistance, Junction to

θJ-C

DDPAK-7

Case(5) (6)

SO PowerPAD-8

(5)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (

θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

(6)

For TO-220 and DDPAK:

θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPAD-

θJ-C refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'.

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