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TL062 Datasheet(PDF) 12 Page - STMicroelectronics |
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TL062 Datasheet(HTML) 12 Page - STMicroelectronics |
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12 / 15 page ![]() Package information TL062, TL062A, TL062B 12/15 Doc ID 2294 Rev 4 5.1 DIP8 package information Figure 20. DIP8 package outline Table 5. DIP8 package mechanical data Note: Dimensions "D" and "E1" do not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.25 mm in total (both sides). Datum plane "H" coincides with the bottom of the lead, where the lead exits the body. Symbol Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 5.33 0.210 A1 0.38 0.015 A2 2.92 3.30 4.95 0.115 0.130 0.195 b 0.36 0.46 0.56 0.014 0.018 0.022 b2 1.14 1.52 1.78 0.045 0.060 0.070 c 0.20 0.25 0.36 0.008 0.010 0.014 D 9.02 9.27 10.16 0.355 0.365 0.400 E7.62 7.87 8.26 0.300 0.310 0.325 E1 6.10 6.35 7.11 0.240 0.250 0.280 e 2.54 0.100 eA 7.62 0.300 eB 10.92 0.430 L 2.92 3.30 3.81 0.115 0.130 0.150 |
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